AppliTek wins project at world's leading provider of advanced semiconductor solutions
Published: 2/15/2008 2:28:00 PM
One of the world's leading providers of advanced semiconductor solutions chose to cooperate with AppliTek in the field of CMP (chemical-mechanical planarization).
In the semiconductor industry chemical-mechanical planarization (CMP) is used to planarize semiconductor substrate.To aid in the planarization of the wafer surface a slurry is introduced between the wafer surface and the polishing pad. Semiconductor device manufacturers frequently add hydrogen peroxide (H2O2) to slurries.
Our analyzer solution is especially developed to measure the H2O2 concentration in the slurry.