On-line monitoring of plating - etching baths
Semiconductor industry
Plating baths typically contain a large number of chemical components. The concentration of many of these chemical components affects the plating rate and the properties of the plated materials. Furthermore, the plating bath composition changes over time due to, for example, chemical and electrochemical depletion of the active components.
With the increased speed of processing, precise chemical concentration control is becoming crucial to wafer processing in order to obtain consistency and more cost-effective manufacturing of integrated circuits. On-line monitoring of the electrolyte bath composition is the solution by excellence to maintaining the electrolyte bath components in proportion.
Application I : electroless copper baths
Copper - EDTA - NaOH - Formaldehyde
Application II : etching baths
Acids: Nitric acid - Acetic acid - Phosphoric acid
Moisture - Hydrogen peroxide
Product list for semiconductor industry:
UPA® Universal Process Analyzer
State of the art multiparameter analyzer platform enabling you to monitor precisely critical process parameters. Theoretically the UPA® Universal Process Analyzer can sample and analyze up to 8 individual streams...
IPA® Industrial Process Analyzer
Single-parameter analyzer platform for all your industrial process liquid applications with a similar hardware and software architecture as the UPA® mainframe, providing top quality with an affordable price tag...
For more information on these systems, please check the following section:
» Go to Analyzers / Wet-chemical process analyzers